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The AI Supply Chain Map: Every Public Company in the AI Buildout (2026)

2026-06-08

The full AI supply chain mapped to public tickers — ~150 companies across 17 layers, from $ASML lithography and $MU/SK Hynix HBM through $COHR photonics and $GEV/$OKLO power to $CRWV neoclouds — with the bottleneck in each layer and a live basket to track it.

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The AI Supply Chain Map: Every Public Company in the AI Buildout (2026)

The AI supply chain is the end-to-end network of public companies that design, manufacture, power, cool, and operate the hardware behind artificial intelligence — from EUV lithography and HBM memory through optical interconnect, power and cooling, all the way to the neocloud operators renting out GPUs. This page maps that chain layer by layer, names the publicly-listed leader in each, and links every layer to a live basket on Macroplane so you can drop in a ticker and trace who depends on whom.

Most "AI stock" lists stop at $NVDA and a handful of hyperscalers. The actual buildout runs through roughly 150 public companies across 17 supply-chain layers, and the most asymmetric exposure is usually three or four links upstream of the names everyone already owns. This is the map.

👉 Trace any link live: every layer below is a basket on Macroplane with continuously-updated performance, and every company has a supplier/customer graph you can open from its ticker page.

Each layer is an equal-weight index, so the spread between the leader and the laggard is doing the talking. In Custom Silicon, $MRVL ran +56% while Alchip ($3661.TW) fell 15% over the same window — the basket view makes that dispersion obvious before you open a single name.

How to read the map

The AI supply chain isn't a list — it's a directed graph. GPUs need HBM; HBM needs advanced packaging; packaging needs metrology tools; the whole fab needs EUV lithography; the finished accelerators need optical interconnect to talk to each other, power to run, and cooling to not melt — then a neocloud rents the cluster out by the hour. Money and risk concentrate at the bottlenecks: the single-supplier choke points where one company gates an entire layer (think $ASML in EUV, $TSM in leading-edge foundry, SK Hynix/$MU in HBM).

Open any ticker and you get exactly this: suppliers feeding in from the left, the company in the centre, customers pulling from the right, with revenue-exposure percentages on the edges that matter. The example above is $AAOI in the Photonics / CPO layer — 68 relationships traced from the filings.

We group the 17 layers into five tiers, top of the stack to bottom.

Tier 1 — Compute & silicon

The chips themselves and the memory that feeds them.

  • Custom Silicon — /baskets/custom-silicon — the chip architects: $NVDA and $AMD in GPUs, $AVGO and $MRVL in custom hyperscaler ASICs, plus $ARM, $QCOM, $INTC, $LSCC, and Alchip ($3661.TW).
  • Memory Supercycle — /baskets/memory-supercycle — DRAM, NAND, and HBM: $MU, SK Hynix ($000660.KS), Samsung ($005930.KS), plus controller/interface names $RMBS, $SIMO, Phison ($8299.TWO), and Kioxia ($285A.T). HBM is the tightest sub-market — track it via the High Bandwidth Memory trend.
  • HBM / Packaging — /baskets/hbm-packaging — the advanced-packaging and test layer that physically stacks HBM onto logic: $AMKR, $ASX, Besi ($BESIY), $KLIC, $TER, $FORM, $COHU, $CAMT, $ONTO, Disco ($6146.T), and $ENTG. See the Advanced Semiconductor Packaging trend.

Tier 2 — Manufacturing & materials

You can't have chips without the machines that print them.

  • Lithography & Fab Tools — /baskets/lithography-fab-tools — the front-end capex layer: $ASML (EUV monopoly), $TSM (the foundry every accelerator routes through), $AMAT, $LRCX, $KLAC, Tokyo Electron ($8035.T), $ASMI, plus $MKSI, $ACLS, $PLAB, and $UCTT.
  • InP & Substrates — /baskets/inp-substrates — the III-V compound-semiconductor base that optical interconnect is built on: $AXTI, $MTSI, Soitec ($SOI), $IQEPY, $VECO, $QRVO, $SWKS, $TSEM, Aixtron ($AIXA), and Win Semi ($3105.TWO).

Tier 3 — Interconnect & networking

Once you have thousands of accelerators, the bottleneck becomes moving data between them.

  • Photonics / CPO — /baskets/photonics-cpo — optical transceivers and co-packaged optics: $COHR, $LITE, $FN, $CIEN, $POET, $AAOI, $VIAV, $NOK, $LWLG, and Sivers ($SIVE.ST). This is the Silicon Photonics & Optical Interconnects trend.

The companies view behind each basket carries the per-name detail — market cap, P/E, 52-week range, and a short-term sparkline — so a layer reads at a glance: $COHR and $LITE anchor the large-cap end, while the sub-$3B names ($POET, Sivers at $SIVE.ST, $LWLG) are where the optical-interconnect optionality sits.

  • Networking / Retimers — /baskets/networking-retimers — AI-fabric switch ASICs and high-speed SerDes: $ALAB, $CRDO, $ANET, $CSCO, $MXL, $MRVL, $AVGO, Alphawave ($AWE), and $SMTC.
  • Connectors & Interconnect — /baskets/connectors-interconnect — the physical layer: $APH, $TEL, $GLW, $BDC, $COMM, $BELFB, and Sumitomo Electric ($5802.T).

Tier 4 — Power, cooling & facilities

The buildout is increasingly gated not by chips but by megawatts and heat.

  • Power & Grid — /baskets/power-grid — generation and grid for the AI energy surge: nuclear operators $CEG, $VST, $TLN; SMR developers Oklo ($OKLO) and NuScale ($SMR); $GEV, $ETN, $HUBB, $POWL, Bloom ($BE), $GNRC, $FLNC, $BWXT, $AMSC, and $VICR. The nuclear leg is the Nuclear Renaissance trend.
  • 800 VDC Architecture — /baskets/800-vdc-architecture — next-gen rack power delivery: $NVTS, $MPWR, $TXN, $STM, $POWI, $ON, $AOSL, $VICR, $ADI, Infineon ($IFNNY), $IPWR, and $WOLF.
  • Cooling — /baskets/cooling — liquid cooling and precision thermal: $VRT, $MOD, $NVT, $JCI, $TT, $AAON, $CARR, Schneider ($SBGSY), and $LII.
  • Construction & MEP — /baskets/construction-mep — the contractors actually building the data centers: $PWR, $EME, $FIX, $MTZ, $DY, $MYRG, and $PRIM.

Tier 5 — Operators, storage & raw inputs

The demand side and the materials underneath everything.

  • AI Cloud / Neoclouds — /baskets/ai-cloud-neoclouds — the operators renting GPU capacity: $CRWV, $NBIS, $IREN, $CLS, $APLD, $HUT, $WULF, $SMCI, $PENG, $CIFR, and $BTDR.
  • Storage — /baskets/storage — absorbing training-dataset and checkpoint I/O: $STX, $WDC, $NTAP, $PSTG, $DELL, and $HPE.
  • Rare Earths — /baskets/rare-earths — the critical-mineral floor under magnets, motors, and fans, and the sharpest geopolitical pressure point: $MP, $USAR, $ALOY, $TMC, $UUUU, Lynas ($LYC.AX), and Iluka ($ILU.AX). Widen the lens via the Rare Earth & Critical Minerals trend.
  • Outliers — /baskets/outliers — clean AI exposure that doesn't fit one bucket: $AEHR, $GFS, $SITM, and $AEIS.

Where the bottlenecks actually are

If you only remember four choke points, remember these:

  • EUV lithography → $ASML. Every leading-edge AI chip in the world is printed on an ASML EUV machine. There is no second supplier.
  • Leading-edge foundry → $TSM. $NVDA, $AMD, $AVGO, $AAPL — the advanced silicon routes through TSMC, which in turn routes through the HBM/packaging layer for CoWoS capacity.
  • HBM → SK Hynix / $MU / Samsung. Three suppliers gate the memory that makes an AI accelerator useful. HBM is sold out quarters in advance.
  • Power → the grid. Increasingly the binding constraint isn't silicon at all; it's interconnection queues and megawatts, which is why nuclear and on-site generation re-rated as AI trades.

The investing edge is that these bottlenecks sit upstream of the obvious names. When you open a company on Macroplane, the supplier/customer graph makes the dependency explicit — you can see, for example, which neocloud's economics ride on which memory supplier, or which photonics name is single-threaded through one laser vendor.

The map vs. an AI ETF

The broad AI/robotics ETFs (BOTZ, AIQ, ROBO, IRBO) give you a cap-weighted slug of mostly mega-cap compute and a long tail of loosely-related software. They systematically underweight the upstream bottleneck layers — packaging, photonics, power — where the asymmetry lives, and they can't show you why a name matters (its position in the chain).

Broad AI ETFThe Macroplane map
CoverageMega-cap compute + software tailAll 17 supply-chain layers, ~150 names
Upstream bottlenecksUnderweightedEach is its own basket
Shows why a name mattersNoSupplier/customer graph per ticker
Customize / weightNoClone any basket, set weights
Cost0.5–0.75%/yrFree to track

This map is a hub. For a deeper read on any branch, the layer-specific guides go further:

  • AI Infrastructure Stocks: The Complete Investor Map — the nine-layer compute-to-cooling breakdown
  • Data Center Stocks: The Picks-and-Shovels Guide — the facility-level view
  • SMR Stocks: The Complete Investor Guide — the nuclear/power leg in depth
  • Rare Earth Stocks: The Complete Investor Guide — the critical-minerals floor

What is the AI supply chain?

The AI supply chain is the network of companies that produce the physical infrastructure for artificial intelligence: chip designers, memory makers, the equipment that fabricates and packages chips, the optical and electrical interconnect that links them, the power and cooling that runs the data center, the contractors that build it, and the cloud operators that rent it out. It's a dependency graph, not a single industry — each layer is a customer of the one upstream of it.

What are the most important AI supply chain stocks?

By bottleneck control: $ASML (EUV lithography), $TSM (leading-edge foundry), and SK Hynix ($000660.KS), $MU, and Samsung ($005930.KS) in HBM memory. By compute: $NVDA, $AMD, $AVGO, and $MRVL. By the increasingly-binding power constraint: $GEV, $CEG, $VST, $OKLO, and $SMR. The full set spans ~150 names — the baskets on Macroplane organize them by layer.

Where are the bottlenecks in the AI supply chain?

The tightest choke points are EUV lithography (single supplier, $ASML), leading-edge foundry capacity ($TSM and its CoWoS advanced-packaging lines), HBM memory (three suppliers, sold out in advance), and — increasingly — electrical power and grid interconnection, which is why nuclear and on-site generation names re-rated as AI trades.

How is this different from buying an AI ETF?

Broad AI ETFs are cap-weighted toward mega-cap compute and dilute into loosely-related software, underweighting the upstream layers (packaging, photonics, power) where the asymmetric exposure sits. They also can't show you a company's position in the chain. Mapping the supply chain lets you target a specific layer and see each name's supplier/customer dependencies directly.

How do I track the AI supply chain over time?

Each layer above is a live basket on Macroplane with continuously-updated performance, and every company page shows its supplier/customer graph, deal flow, and financials. Start from any ticker and traverse upstream or downstream to see who depends on whom.

Related reading

  • AI Infrastructure Stocks: The Complete Investor Map
  • Data Center Stocks: The Picks-and-Shovels Guide
  • SMR Stocks: The Complete Investor Guide
  • Rare Earth Stocks: The Complete Investor Guide
  • How to Map Any Public Company's Supply Chain

What is the AI supply chain?

The AI supply chain is the network of companies that produce the physical infrastructure for artificial intelligence: chip designers, memory makers, the equipment that fabricates and packages chips, the optical and electrical interconnect that links them, the power and cooling that runs the data center, the contractors that build it, and the cloud operators that rent it out. It's a dependency graph, not a single industry — each layer is a customer of the one upstream of it.

What are the most important AI supply chain stocks?

By bottleneck control: $ASML (EUV lithography), $TSM (leading-edge foundry), and SK Hynix ($000660.KS), $MU, and Samsung ($005930.KS) in HBM memory. By compute: $NVDA, $AMD, $AVGO, and $MRVL. By the increasingly-binding power constraint: $GEV, $CEG, $VST, $OKLO, and $SMR. The full set spans ~150 names — the baskets on Macroplane organize them by layer.

Where are the bottlenecks in the AI supply chain?

The tightest choke points are EUV lithography (single supplier, $ASML), leading-edge foundry capacity ($TSM and its CoWoS advanced-packaging lines), HBM memory (three suppliers, sold out in advance), and — increasingly — electrical power and grid interconnection, which is why nuclear and on-site generation names re-rated as AI trades.

How is this different from buying an AI ETF?

Broad AI ETFs are cap-weighted toward mega-cap compute and dilute into loosely-related software, underweighting the upstream layers (packaging, photonics, power) where the asymmetric exposure sits. They also can't show you a company's position in the chain. Mapping the supply chain lets you target a specific layer and see each name's supplier/customer dependencies directly.

How do I track the AI supply chain over time?

Each layer above is a live basket on Macroplane with continuously-updated performance, and every company page shows its supplier/customer graph, deal flow, and financials. Start from any ticker and traverse upstream or downstream to see who depends on whom.

Referenced on this page

  • basket on Macroplane
  • Photonics / CPO
  • /baskets/custom-silicon
  • /baskets/memory-supercycle
  • High Bandwidth Memory trend
  • /baskets/hbm-packaging
  • Advanced Semiconductor Packaging trend
  • /baskets/lithography-fab-tools
  • /baskets/inp-substrates
  • Silicon Photonics & Optical Interconnects trend
  • /baskets/networking-retimers
  • /baskets/connectors-interconnect
  • /baskets/power-grid
  • Nuclear Renaissance trend
  • /baskets/800-vdc-architecture
  • /baskets/cooling
  • /baskets/construction-mep
  • /baskets/ai-cloud-neoclouds
  • /baskets/storage
  • /baskets/rare-earths
  • Rare Earth & Critical Minerals trend
  • /baskets/outliers
  • AI Infrastructure Stocks: The Complete Investor Map
  • Data Center Stocks: The Picks-and-Shovels Guide
  • SMR Stocks: The Complete Investor Guide
  • Rare Earth Stocks: The Complete Investor Guide
  • How to Map Any Public Company's Supply Chain