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AI Bottleneck Baskets

Curated, equal-weight baskets of public companies tracking the bottlenecks in the AI buildout — from memory and photonics to power, grid, and packaging.

  • AI Cloud / Neoclouds — Pure-play AI cloud and HPC compute providers (IREN, NBIS, CRWV, CLS, APLD, HUT)
  • Cooling — Liquid cooling, thermal management, HVAC for data centers (VRT, MOD, NVT, JCI, TT, AAON)
  • Custom Silicon — GPUs, accelerators, custom AI ASICs (MRVL, AVGO, NVDA, AMD, INTC, ARM, QCOM)
  • HBM / Packaging — Advanced packaging, test, HBM toolchain (CAMT, ONTO, ENTG, COHU)
  • InP & Substrates — Indium phosphide and III-V substrates for photonics (AXTI, MTSI, SOI, WOLF)
  • Lithography & Fab Tools — Litho/etch/dep tools — fab capex (ASML, TSM, LRCX, KLAC, AMAT)
  • Memory Supercycle — Memory cycle play (MU, SNDK, TOWCF)
  • Networking / Retimers — Switches, NICs, retimers, optical-electrical bridges (ALAB, CRDO, ANET, CSCO)
  • Photonics / CPO — Optical interconnects, co-packaged optics, transceivers (COHR, LITE, FN, CIEN, POET, IPGP, SIVE.ST)
  • Power & Grid — Grid build-out, transformers, nuclear & gas peakers powering AI load (GEV, TLN, CEG, VST, POWL, AMSC, BE, ETN, HUBB, VICR, GNRC, TXN, EMR, ROK)
  • Connectors & Interconnect — High-speed connectors and cabling (APH, TEL, GLW)
  • Construction & MEP — Data-center general contractors, electrical, mechanical, fit-out (PWR, EME, FIX, MTZ, DY)
  • Outliers — High-conviction names that don't fit a single bucket (AAOI, BESIY, AEHR, KLIC)
  • Rare Earths — Critical minerals and processing (MP, ALOY, USAR, TMC)
  • Storage — Enterprise storage and HDD/SSD makers (STX, WDC, NTAP, PSTG)

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