Switch ASICs, PCIe/CXL smart retimers, SerDes chiplets, active electrical cable DSPs, and optical-electrical bridge chipsets forming the high-bandwidth interconnect layer of AI training clusters — spanning custom switch silicon (AVGO Tomahawk/Jericho, MRVL Prestera/Kinetic, NVDA Spectrum), AI fabric system OEMs (ANET, CSCO), PCIe/CXL smart retimers and active copper cable ICs (ALAB, Parade/4966), next-gen SerDes chiplets and AEC DSPs (CRDO, AWE Alphawave), PAM4 optical bridge chips and transceiver DSPs (MXL), and signal-integrity ICs for 100G–800G optical links (SMTC).