Advanced packaging equipment, test systems, and process materials enabling HBM stacking and heterogeneous AI chip integration — spanning TCB and die bonding (Besi, Kulicke & Soffa, ASMPT), OSAT foundries (Amkor, ASX), wafer inspection and metrology (Camtek, Onto, Nova), handler and probe-card test (Cohu, FormFactor), the ATE memory-test duopoly (Teradyne, Advantest), precision dicing (Disco), and specialty process chemicals and CMP materials (Entegris).