Leading-edge semiconductor equipment and process materials suppliers — EUV and DUV lithography systems (ASML, Nikon), etch/deposition (Lam, Applied Materials, Tokyo Electron), ALD and epitaxy (ASM International), process control and yield management (KLA), photomasks (Photronics), ion implant (Axcelis), gas/RF delivery (MKS), parts cleaning (Ultra Clean), and photoresists plus silicon wafers (Shin-Etsu Chemical) — alongside TSMC as the primary foundry beneficiary of the AI-driven front-end capex supercycle.