High-speed electrical connectors and cable assemblies (Amphenol, TE Connectivity, Hirose Electric, JAE, Luxshare, Foxconn Interconnect/FIT Hon Teng), optical fiber and copper cabling (Corning, Prysmian, Nexans, Belden, Sumitomo Electric, Furukawa Electric), and power/signal connectivity components (Bel Fuse, Methode) forming the physical layer that links GPUs, switches, and racks in hyperscale AI data-center builds.