Advanced packaging equipment, test systems, process materials, and substrates enabling HBM stacking and heterogeneous AI chip integration — spanning TCB and die bonding (Besi, Kulicke & Soffa, ASMPT), OSAT foundries (Amkor, ASX, JCET), wafer inspection and metrology (Camtek, Onto, Nova), handler and probe-card test (Cohu, FormFactor), the ATE memory-test duopoly (Teradyne, Advantest), precision dicing (Disco), specialty process chemicals and CMP materials (Entegris), and the FC-BGA/ABF substrate makers whose capacity constraints gate AI GPU and HBM output (Ibiden, Unimicron, Nan Ya PCB, Samsung Electro-Mechanics).