Advanced packaging equipment, test systems, and process materials enabling HBM stacking and heterogeneous AI chip integration — spanning TCB and die bonding (Besi, Kulicke & Soffa), OSAT foundries (Amkor, ASX), wafer inspection and metrology (Camtek, Onto), handler and probe-card test (Cohu, Teradyne, FormFactor), precision dicing (Disco), and specialty process chemicals (Entegris).