Design and manufacturing of semiconductor chips and integrated circuits — including AI training and inference accelerators, AI vision systems-on-a-chip, ASICs, logic and analog ICs, memory (DRAM, NAND, HBM, emerging), automotive and power semiconductors, RF and wireless ICs, sensors and MEMS, IP cores, fabless design, and space-grade radiation-hardened devices.
HBM — High Bandwidth Memory — 3D-stacked DRAM (HBM2E/HBM3/HBM3E/HBM4) connected via through-silicon vias, delivering 1+ TB/s of bandwidth per stack. Co-packaged with GPUs, TPUs, and custom AI accelerators for datacenter AI training/inference and HPC workloads.
IP Cores — Licensed semiconductor IP blocks (ARM cores, PHY, SerDes, interfaces)
Logic ICs — CPUs, GPUs, FPGAs, and general-purpose logic chips
NAND Flash — NAND flash memory and solid-state storage
Power Semiconductors — Discrete power devices — silicon MOSFETs and IGBTs plus wide-bandgap GaN and SiC transistors and diodes — used to switch and convert electrical power in EVs and chargers, solar/wind inverters, datacenter PSUs, industrial drives, appliances, and consumer adapters.
