Design and manufacturing of semiconductor chips and integrated circuits — including AI training and inference accelerators, logic and analog ICs, memory (DRAM, NAND, HBM, emerging), automotive and power semiconductors, RF and wireless ICs, sensors and MEMS, IP cores, fabless design, and space-grade radiation-hardened devices.
HBM — High Bandwidth Memory — 3D-stacked DRAM (HBM2E/HBM3/HBM3E/HBM4) connected via through-silicon vias, delivering 1+ TB/s of bandwidth per stack. Co-packaged with GPUs, TPUs, and custom AI accelerators for datacenter AI training/inference and HPC workloads.
IP Cores — Licensed semiconductor IP blocks (ARM cores, PHY, SerDes, interfaces)
Logic ICs — CPUs, GPUs, FPGAs, and general-purpose logic chips
NAND Flash — NAND flash memory and solid-state storage
Power Semiconductors — Discrete power devices — silicon MOSFETs and IGBTs plus wide-bandgap GaN and SiC transistors and diodes — used to switch and convert electrical power in EVs and chargers, solar/wind inverters, datacenter PSUs, industrial drives, appliances, and consumer adapters.
