Sector: Technology · Industry: 半導體業 · Exchange: TPEx
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductors; invests in, develops, manufactures, and sells electronic components; and manufactures and sales elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
Headquarters: Hsinchu City, TW · Website: https://www.chipbond.com.tw
頎邦 (6147) is a publicly traded company in the Technology sector (半導體業), listed on TPEx. Macroplane maps its supply-chain relationships, suppliers, buyers, financial health, and competitive positioning.
Competitors of 頎邦 (6147) tracked by Macroplane include Advanced Semiconductor Engineering (ASE Technology Holding) (ASE), ASE Technology Holding Co., Ltd. (ASX), ASE Technology Holding Co., Ltd. (3711), ASE Technology Holding Co., Ltd. (3711.TW), FLEX LTD. (FLEX), AMKOR TECHNOLOGY, INC. (AMKR), JCET Group Co., Ltd. (600584.SS), Tongfu Microelectronics Co., Ltd. (002156.SZ), and 4 more.
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