Sector: Technology · Industry: Semiconductors
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
Headquarters: Pyeongtaek-Si · Website: https://www.lbsemicon.com
LB Semicon Inc. (061970.KQ) is a publicly traded company in the Technology sector (Semiconductors). Macroplane maps its supply-chain relationships, suppliers, buyers, financial health, and competitive positioning.
Competitors of LB Semicon Inc. (061970.KQ) tracked by Macroplane include Advanced Semiconductor Engineering (ASE Technology Holding) (ASE), ASE Technology Holding Co., Ltd. (ASX), ASE Technology Holding Co., Ltd. (3711), ASE Technology Holding Co., Ltd. (3711.TW), FLEX LTD. (FLEX), AMKOR TECHNOLOGY, INC. (AMKR), JCET Group Co., Ltd. (600584.SS), Tongfu Microelectronics Co., Ltd. (002156.SZ), and 4 more.
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